JPH0648863Y2 - 集積回路の冷却構造 - Google Patents

集積回路の冷却構造

Info

Publication number
JPH0648863Y2
JPH0648863Y2 JP1989147035U JP14703589U JPH0648863Y2 JP H0648863 Y2 JPH0648863 Y2 JP H0648863Y2 JP 1989147035 U JP1989147035 U JP 1989147035U JP 14703589 U JP14703589 U JP 14703589U JP H0648863 Y2 JPH0648863 Y2 JP H0648863Y2
Authority
JP
Japan
Prior art keywords
integrated circuit
cooling structure
transfer plate
heat transfer
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1989147035U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0385652U (en]
Inventor
光彦 仲田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP1989147035U priority Critical patent/JPH0648863Y2/ja
Publication of JPH0385652U publication Critical patent/JPH0385652U/ja
Application granted granted Critical
Publication of JPH0648863Y2 publication Critical patent/JPH0648863Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
JP1989147035U 1989-12-22 1989-12-22 集積回路の冷却構造 Expired - Lifetime JPH0648863Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989147035U JPH0648863Y2 (ja) 1989-12-22 1989-12-22 集積回路の冷却構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989147035U JPH0648863Y2 (ja) 1989-12-22 1989-12-22 集積回路の冷却構造

Publications (2)

Publication Number Publication Date
JPH0385652U JPH0385652U (en]) 1991-08-29
JPH0648863Y2 true JPH0648863Y2 (ja) 1994-12-12

Family

ID=31693568

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989147035U Expired - Lifetime JPH0648863Y2 (ja) 1989-12-22 1989-12-22 集積回路の冷却構造

Country Status (1)

Country Link
JP (1) JPH0648863Y2 (en])

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004093187A1 (ja) * 2003-04-16 2004-10-28 Fujitsu Limited 電子部品パッケージ、電子部品パッケージ組立体およびプリント基板ユニット
JP4839281B2 (ja) * 2007-08-13 2011-12-21 游聰謀 スイッチの自動切断構造

Also Published As

Publication number Publication date
JPH0385652U (en]) 1991-08-29

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